![]() ![]() Feature solid pins, which is different from pin deformation occurring to QFP (quad flat package) Į. Evidently defeat coplanarity issue and greatly reduce coplanar damage ĭ. Dramatically improve component pins while decreasing package size, reducing the application area of base Ĭ. ![]() Sensitive to both humidity and heat, perhaps leading to relatively low reliability īased on the brief introduction of different categories of BGA packages, features of BGA package components can be summarized into the following:ī. Capable of aligning with PCB pad through package edge ĭ. Brings forward good hot pressing matching with PCBs using epoxy resin as substrate material ī. Characteristics of TBGA package contain:Ī. TBGA is a type of package taking advantage of tape interconnection for connection achievement between chip, solder balls and PCB. It's difficult for alignment between package edge and PCB to take place, leading to a high cost of packaging. Due to different coefficients of thermal expansion, CBGA features bad hot pressing matching with PCB boards applying epoxy resin as substrate so that solder joint fatigue has become the primary failure type of CBGA į. Features good coplanarity that is approximately 100μm and solder joints are easily generated Į. CBGA features the following characteristics:ī. ![]() Solder balls belonging to CBGA are manufactured by high-temperature solder, which are then connected with ceramic base through the application of eutectic solder with a low melting point (usually 63Sn/Pb) that is then leveraged to make solder balls connected with PCB (printed circuit board). Can be accurately aligned with PCB pad through package edge. Solder balls contribute to the generation of solder joints, leading to flexible coplanarity that is approximately 250μm Į. Features excellent hot pressing matching with epoxy resin ī. PBGA places solder balls on the base with the following properties:Ī. Up to now, BGA package can be classified into three categories in accordance with base types: PBGA (plastic ball grid array), CBGA (ceramic ball grid array), TBGA (tape ball grid array). ![]()
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |